Job Description

Seeking a highly motivated and experienced Advanced Packaging Process Engineer to drive the development and optimization of cutting-edge packaging technologies for power module products. This role will be instrumental in ensuring our products' competitiveness through the implementation of the latest industry capabilities in a high-volume manufacturing environment.

• Optimizing and establishing robust, high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology.
• Defining simplified manufacturing process sequences for different component attachment methods.
• Managing multiple new product executions from kick-off, product prototyping, characterization, learning cycles, and qualifications through to RTM, including project documentation.
• Collaborating closely with factory operations teams to meet manufacturing indices, quality standards, and cost targets.
• Engaging with global package platform and emerging technology teams to execute differentiated technology roadmaps and establish process capabilities proactively.
• Driving power module package competitiveness by adopting the latest industry advancements in high-volume manufacturing.

Growing and Expanding organisationAttractive Benefits

• Bachelor's degree in Mechanical Engineering, Physics, Material Science, or a related field.
• Minimum 8 years of experience in the semiconductor field.
• Experience with SMT and leaded module technologies.
• Broad and deep technical understanding of QFN packages integrated with wire bond interconnect, flip-chip interconnect, passive component, and inductor integration.
• Project management experience in the semiconductor industry, specifically in Assembly Test or SMT operations.
• Experience with assembly of power module packaging, substrate design, and reliability requirements.
• Hands-on experience with flip-chip, chip shooter, or other component attachment equipment (for resistors, capacitors, inductors, clips).

Our client is a renowned semiconductor player expanding their footprint in Malaysia.

• Great salary package and long term career development plans
• Being part of a market leader in the semiconductor world.

Michael Page