Job Details:
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Become a member of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team. The role is located in Kulim as a Handling Systems development engineer leading the development and deployment of Intel's advanced chip packaging process technology. In this position, you will be directly responsible for developing material handling technology involving high accuracy and high-speed pick-n-place systems for next generation semiconductor packaging technology.
Your responsibilities include, but are not limited to:
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