Job Description

MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationPerak Job type Discipline Reference276684_1732267324Assembly Package Development EngineerJob descriptionThis global semiconductor company in Perak is seeking an Assembly Package Development Engineer.Key Responsibilities:

• Design, develop, and qualify new semiconductor packaging solutions that meet both internal and customer specifications.
• Innovate and refine packaging technologies, focusing on improving performance, reliability, and manufacturability.
• Work on the full lifecycle of packaging projects, from concept design through to qualification and mass production.
• Engage directly with customers to understand their packaging requirements and provide tailored packaging solutions.
• Further develop and enhance packaging designs provided by customers to
• optimize for performance and manufacturability.
• Serve as a key technical liaison between Carsem's engineering teams and customers throughout the packaging development process.
• Investigate new materials, processes, and technologies to advance semiconductor packaging capabilities.
• Continuously improve existing packaging designs to optimize yield, reliability, and cost-effectiveness.
• Stay abreast of the latest trends and advancements in semiconductor packaging and introduce new technologies where applicable.
• Lead and manage packaging development projects, ensuring adherence to project timelines and budgets.
• Work cross-functionally with process engineering, product development, quality, and operations teams to ensure seamless execution of projects.
• Prepare detailed technical reports, documentation, and presentations on packaging development and project status

Skills & Experience Required:

• Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• 8 to 15 years of experience in semiconductor packaging, with strong expertise in package development and integration.
• Experience with various semiconductor packaging technologies, including wire bonding, flip chip, BGA, QFN, WLCSP, etc would be a bonus.
• Ability to develop new packaging solutions from scratch and enhance customersupplied designs.
• Strong problem-solving skills and ability to work with cross-functional teams.
• Excellent communication skills, with the ability to effectively collaborate with

• customers and internal stakeholders.

To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.Sign up for job alertsIf you are a human, ignore this field Create alertYou agree to ourShare this jobAssembly Package Development EngineerPerak Posted about 18 hours agoQuick LinksConnectWe are committed to Building Better Futures for the organisations we work for, the professionals we help, and our own employees.Agensi Pekerjaan Ambition Group Malaysia Sdn. Bhd.JTK Number: JTKSM 995Company Registration Number: 201301019088 (1048918-T)MalaysiaSuite 8.03 & 8.05, Level 8, The Gardens North Tower, Mid Valley City, Lingkaran Syed Putra

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