Job Description

MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationPerak Job type Discipline Reference276685_1732267167Assembly Package Development ManagerJob descriptionThis global semiconductor company in Perak is seeking an Assembly Package Development Manager.Key Responsibilities:

• Lead the design, development, and qualification of new semiconductor packaging solutions, ensuring they meet both industry standards and customerspecific requirements.
• Drive continuous improvement in packaging technology, materials, and processes to enhance performance, reliability, and manufacturability.
• Work closely with internal teams (product engineering, operations, quality) and external customers to develop cutting-edge packaging solutions that align with market demands.
• Collaborate directly with customers to understand their packaging needs and deliver customized solutions.
• Enhance and further develop customer-provided packaging designs to ensure they meet performance specifications and manufacturing requirements.
• Serve as the technical point of contact for customers during the package development lifecycle, addressing any concerns or adjustments as needed.
• Manage and execute packaging development projects, ensuring timely delivery, budget adherence, and high-quality results.
• Coordinate cross-functional teams, including process engineers, material scientists, and quality assurance, to achieve project milestones.
• Develop project plans, timelines, and deliverables, ensuring alignment with customer and organizational goals.
• Stay updated on the latest semiconductor packaging technologies, trends, and market requirements.
• Introduce innovative packaging technologies and materials to the organization, enhancing product performance and reducing costs.
• Implement continuous improvement processes within the packaging team, focusing on quality, yield improvement, and cost optimization.
• Lead, mentor, and develop a team of engineers and technicians within the packaging department.
• Foster a collaborative and high-performance work culture, encouraging innovation and knowledge sharing.
• Ensure all packaging designs, materials, and processes comply with industry standards, regulatory requirements, and customer specifications.
• Maintain thorough documentation of packaging development processes, specifications, and test results.

Skills & Experience Required:

• Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• 8 to 15 years of experience in semiconductor packaging, with a strong background in package development, integration, and optimization.
• Proven experience developing packaging solutions from scratch, as well as enhancing customer-provided designs.
• Strong knowledge of semiconductor packaging technologies, including wire bonding, flip chip, BGA, QFN, and WLCSP would be advantageous.
• Experience managing end-to-end development projects, from concept to production.
• Excellent problem-solving, analytical, and leadership skills.
• Strong communication and interpersonal skills, with the ability to engage with cross-functional teams and customers.
• Experience working in a global semiconductor packaging environment.
• Familiarity with materials science and failure analysis related to packaging would be an added benefit.
• Understanding of reliability testing and quality control for packaging solutions would be a plus.
• Visa sponsorship is available for this position - expatriates ae welcome to apply.

To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.Sign up for job alertsIf you are a human, ignore this field Create alertYou agree to ourShare this jobAssembly Package Development ManagerPerak Posted about 18 hours agoQuick LinksConnectWe are committed to Building Better Futures for the organisations we work for, the professionals we help, and our own employees.Agensi Pekerjaan Ambition Group Malaysia Sdn. Bhd.JTK Number: JTKSM 995Company Registration Number: 201301019088 (1048918-T)MalaysiaSuite 8.03 & 8.05, Level 8, The Gardens North Tower, Mid Valley City, Lingkaran Syed Putra

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