Job Description

Job Summary:

To be responsible and focus on the design, development, and optimization of Ball Grid Array components used in electronic devices, particularly in high-speed and high-density applications. Responsibilities include defining product requirements, optimizing BGA pinouts, and ensuring signal and power integrity, often collaborating with various teams to achieve optimal performance and manufacturability.

Key Responsibilities :

1. Defining Product Requirements: Working with system architects and product teams to establish specifications for BGA components.

2. Process Engineering- Develop and optimize BGA assembly processes (wire bond or flip chip, underfill, ball attach, reflow, cleaning).

3. Process Engineering- Ensure robust BGA solder ball formation and reflow profiles and troubleshoot BGA-related assembly issues like voids, open/short balls, delamination, etc.

4. Process Engineering- Lead process excursions and implement corrective/preventive actions

5. Yield Improvement & Failure Analysis- Perform root cause analysis on assembly/packaging failures (e.g., solder cracks, head-in-pillow). Lead FA discussion with FA engineer for FA activities like X-ray, CSAM, SAT, Cross-sectioning, and SEM/EDX.

6. Yield Improvement & Failure Analysis- working with customer to establish the rework process for certain defect.

7. Manufacturing & Sustaining Support- Establish manufacturing process controls (SOPs, FMEAs, SPC), Monitor and maintain process KPIs (yield, defect rate, cycle time).

8. Manufacturing & Sustaining Support- Lead process excursions and implement corrective/preventive actions

9. Cross-functional Collaboration- Work closely with vendors, quality teams and Interface with customer on BGA packaging inquiries or issues

10. Cross-functional Collaboration- Support new product introduction (NPI) and design for manufacturability (DFM).

11. Knowledge of ISO 9001, ISO 14001, ISO 13485, IATF 16949 standards is a plus

Skills

Technical Skills:

Knowledge of

BGA packaging structure

and

substrate design

.

Familiarity with

DDR, DFN memory architecture

and

QFN requirements

.

Hands-on experience with

soldering, reflow, flux processes and cleaning

.

Understanding of

JEDEC standards

(MSL, package outline, thermal characterization).

Experience with

FA tools is a plus

: X-ray, CSAM, SAT, cross-section, FIB.

Analytical & Problem Solving:

Strong

data analysis

skills (yield trends, DOE, root cause analysis).

Experience with statistical tools (JMP, Minitab, SPC charts).

Knowledge of

thermal/mechanical/electrical simulation tools

is a plus.

Soft Skills:

Good communication and cross-functional teamwork.

Project management for new product introduction.

Attention to detail and quality mindset.

Ability to work with external vendors or customers.

Qualifications :

Above 5 years of experience with Bachelor's degree in Engineering or Technology (Mechanical / Manufacturing Technology).

Strong proficiency in Mandarin speaking (Chinese Literate)

Job Type: Full-time

Pay: RM5,500.00 - RM7,500.00 per month

Benefits:

Additional leave Dental insurance Flexible schedule Free parking Health insurance Maternity leave Opportunities for promotion Parental leave Professional development
Schedule:

Monday to Friday
Supplemental Pay:

Yearly bonus
Work Location: In person