Bga Wb Process Engineer
Job Description
Lead improvement at the Wire Bond Process and manage all process control system to maximize quality outputs.Champion the Statistical Process Control reporting for the BGA WB department.Drive WB LOH to align to NXP Goal and meet customer on time delivery.Drive all quality excursions at the Wire Bonding processDrive yield improvement activities for all the BGA WBWork closely with the NPI teamJob QualificationBachelor\'s degree in Engineering related and 1 -2 years wire bonding experience would be an added advantage.Knowledge in Statistical analysis tool experience (eg: JMP)High ownership and accountability to ensure targets are achieved in a timely manner.Excellent interpersonal communications skills and ability to work well in a team environment to develop positive relationships.Takes initiative, action-oriented and constantly raises the bar to drive excellent results.Possess quality mindset and engineering curiosity to deep dive for continuous improvement.
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Job Detail
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Job IdJD1071880
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationKuala Lumpur, Malaysia
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EducationNot mentioned