Job Description

Our client is the global leader in mining consulting and services. They offer complete design and manufacturing system of blockchain miners and are now looking for a Chip Operation Product Engineer to join their ever-growing team.
Job Responsibilities

• Collaborate with chip and packaging design teams to conduct DFM (Design for Manufacturability) check to ensure Si and package manufacturability.
• Work with product team to estimate the chip yield and set appropriate SKU combination binning scheme.
• Interface foundry on Si fabrication, take charge of Si wafer NTO planning, performing WAT and yield analysis. Drive foundry on corrective actions for yield loss or quality degradation.
• Interface OSAT on wafer bumping and assembly. Ensure bumping and substrate DFM inputs from OSAT be implemented into package design, and co-define process BKM with vendors and monitor process quality.
• Perform chip level and package reliability qual with collaboration with internal product team and suppliers. Ensure chip package meeting application spec.
• Working with ATE team on chip CP and FT test coverage and yield analysis. Monitor yield trend and identify failure mechanism by fast eFA and pFA. .
• Assist the quality department in analyzing customer RMAs and provide technical and experimental suggestions.

• A bachelor's degree or above major in microelectronics, physics, or material science or electrical engineering.
• 3 years experience on Si chip product engineering, prefer on digital chips. Experienced on interface with foundry or package house.
• Understanding semiconductor fabrication and test flow. Knowledge of advanced CMOS, advanced package is a plus.
• Knowledge on common CMOS Si and package failure, mechanism, and corrective action is a plus.
• Knowledge on JEDEC reliability spec, qualification flow, and quality spec is a plus.
• Familiar with common failure analysis methods such as SEM, X-Ray, EMMI, and SAT is a plus.
• Skilled on statistical yield data analysis, and proficient on using YMS tools.