Job Description

MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor is seeking a Die Bond Development Engineer who specializes in Soft Solder Die Attach.Key Responsibilities:

• Soft Solder Die Attach Expertise: Utilize your in-depth knowledge of Soft Solder Die Attach techniques to develop and improve semiconductor packaging solutions.
• R&D Project Management: Lead and contribute to various R&D projects related to semiconductor packaging, ensuring they are completed on time and within budget.
• Experiment Design: Plan and execute experiments to evaluate and optimize the performance of Soft Solder Die Attach processes and materials.
• Data Analysis: Analyze experimental data and test results to identify trends and areas for improvement.
• Materials Selection: Collaborate with materials scientists and engineers to choose suitable materials for die attach processes.
• Process Optimization: Continuously refine and optimize die attach processes for efficiency and performance.
• Quality Assurance: Ensure that all products and processes meet stringent quality and reliability standards.
• Documentation: Maintain detailed records of experiments, results, and findings to support research and development efforts.
• Cross-Functional Collaboration: Collaborate with cross-functional teams, including design, testing, and production, to transfer successful processes to manufacturing.
• Technical Innovation: Stay updated on industry trends and emerging technologies in semiconductor packaging and apply this knowledge to improve our products.

Skills & Experience Required:

• Bachelor\'s, Master\'s, or Ph.D. in Electrical Engineering, Materials Science, or a related field.
• Proven experience in Soft Solder Die Attach techniques within a semiconductor company or related industry.
• Strong knowledge of semiconductor packaging technologies, materials, and manufacturing processes.
• Excellent problem-solving skills and the ability to think critically.
• Proficiency in data analysis tools and software (e.g., MATLAB, Python, or similar).
• Strong communication and teamwork skills, with the ability to collaborate effectively with cross-functional teams.
• Attention to detail and a commitment to quality.
• A self-motivated and innovative mindset with a passion for staying current with industry trends.

To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)If this job isn\'t quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.Sign up for job alertsIf you are a human, ignore this field Create alertYou agree to ourShare this jobDie Bond Development EngineerSelangor Posted about 16 hours agoQuick LinksConnectWe are committed to Building Better Futures for the organisations we work for, the professionals we help, and our own employees.

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