Job Description

Malaysia

Job details Posted 12 September 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1694500453

Die Bond Equipment Engineer

Job description

This rapidly expanding semiconductor company in Melaka is seeking a Die Bond Equipment Engineer due to expansion.

Key Responsibilities:

• Equipment Maintenance: Perform routine and preventive maintenance on die bond equipment to ensure it operates at peak efficiency. Troubleshoot and repair equipment issues promptly to minimize downtime.
• Process Optimization: Collaborate with process engineers to optimize die bond processes for improved yield, throughput, and quality. Implement improvements and enhancements as needed.
• Equipment Operation: Operate die bond equipment during production runs, monitoring and adjusting settings to meet quality and production targets. Ensure the equipment is calibrated and maintained according to industry standards.
• Quality Assurance: Conduct inspections and quality checks on bonded dies to ensure they meet specifications and quality standards. Address any deviations and take corrective actions when necessary.
• Documentation: Maintain accurate records of equipment maintenance, adjustments, and process changes. Create and update standard operating procedures (SOPs) for die bond equipment operation.
• Training: Train and mentor technicians and operators on the safe and effective operation of die bond equipment. Provide guidance on best practices and troubleshooting techniques.
• Safety: Adhere to all safety protocols and guidelines when working with equipment. Promote a culture of safety within the team.
• Continuous Learning: Stay up-to-date with advancements in die bond equipment technology and semiconductor manufacturing processes. Implement best practices and innovative solutions to drive efficiency and quality improvements.

Skills & Experience Required:

• Bachelor\'s degree in Electrical Engineering, Mechanical Engineering, or a related field (or equivalent work experience).
• Proven experience working with die bond equipment in a semiconductor manufacturing environment.
• Strong troubleshooting skills and the ability to diagnose and resolve equipment issues.
• Proficiency in programming and configuring die bond equipment.
• Excellent attention to detail and commitment to quality.
• Effective communication skills and the ability to work collaboratively in a team.
• Knowledge of semiconductor manufacturing processes is a plus.
• Safety-conscious mindset.

To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

If this job isn\'t quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.

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Die Bond Equipment Engineer

Malaysia Posted about 19 hours ago

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JTK Number: JTKSM 995

Company Registration Number: 201301019088 (1048918-T)

Malaysia

Ambition Group Malaysia, BO1-B-10, Boutique Offices 1 Menara 2, 3, Jalan Bangsar, KL Eco City

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