Job Description

Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we\'ve been doing just that. Our technology helped people put a man on the moon.We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world\'s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.Binge-watch any shows, use social media or shop online lately? You\'ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That\'s us, too.We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital\xc2\xae, G-Technology\xe2\x84\xa2, SanDisk\xc2\xae and WD\xc2\xae brands.Today\'s exceptional challenges require your unique skills. It\'s You & Western Digital. Together, we\'re the next BIG thing in data.ESSENTIAL DUTIES AND RESPONSIBILITIES:In this position, the individual will be responsible for fully supporting the Department Manager on the development of the company goals, strategy and tactics. The most important expectation is being able to work with the other team to assure the good execution of daily activities and special assignments assigned by department managers or higher management. The individual will be responsible to lead the process engineering functions for DP process. He/she is required to work closely with the teams within Assembly Process Engineering department as well as other functional teams; manufacturing, EE, IPPC, QA ,NPI and other supporting teams to fully support the company and department goals on yield, quality, and cost, utilization, productivity and cycle time. Good knowledge in Die Preparation and hands on experience.QualificationsTo be qualified for this position, the individual shall come with the following skills;

• Able to lead a group of process engineers and technician. Be a mentor and coach for the engineers and technicians, provide the technical supports whenever necessary.
• Good in problem solving skills by applying the standard solving methodology, DMAIC, 8D, etc
• Good working knowledge in MSA & SPC and DOE.
• Document of SOP, WI, FMEA, FMEA+, OCAP and Control Plan for related process.
• Ensure effective hand shaking process of new device/product introduction to the line and new process technology capabilities developments.
• Responsible for new material/component first articles inspection and final buyoff.
• Continuous improvement on direct/indirect material cost down & yield enhancement program.
• Ensure robustness of process control to meet yield & through-put expectation.
• Report any non-conformance/customer complains issue and develop/follow up the improvement actions.
• Lead or work together with other sites of WD for project transfer or sharing of improvement projects.
• Fully participate to resolve the issue thru teamwork and be the main coordinator for any internal/ external audit programs.

REQUIRED:

• Master or Bachelor degree in Mechanical/Material/Electrical/Electronic Engineering 0r Physics
• 5+ years of process engineering experience in semiconductor assembly on engineering for equipment maintenance/repair/improve in DP.
• Accept flexible working time if needed.

Additional InformationSKILLS:

• Knowledge/hands-on in Disco DP machine much advantage and Prefer knowledge in Disco model Stealth Dicing DFL7361, DAF Laser/Laser Groove DFL7160, wafer sawing DFD6361 and back grinding DGP8761 & DFM2800.
• Involved in yield improvement activities using statistic tools and drive yield meeting with internal and external team.
• Lean Six Sigma Knowledge is preferable.
• Basic understanding of package level testing & reliability.
• Proficient in standard business application software, Tools & standard engineering method (Word, Excel, PowerPoint, AutoCAD, JMP, SPC, DOE, DMAIC, 8D, 5-why etc.).
• A proven desire to work as a team member, both on the same team and outside of the team.
• Ability to troubleshoot and analyze complex problems.
• Ability to multi-task and meet deadlines.
• Fluent in Mandarin and English communication, additional language skills a plus. The job nature requires communicating with China/US people.

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.NOTICE TO CANDIDATES: Western Digital has received reports of scams where a payment is requested on Western Digital\'s behalf as a condition for receiving an offer of employment. Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to .

Western Digital