Job Description

I

n your new role you will:
I

• ndependent Physical Failure Analysis operation and job administration P

• rovide consultation to customer related to PFA and determine the right analysis methods I

• dentify problems or unfavorable deviations, recommend and execute/implement corrective/improvement actions which enhance the quality, reliability or cost effectiveness in the area of responsibility. P

• erform PFA generalist job, i.e. XSEM, Construction Analysis, Chemical & other within timeline independently P

• erform PFA specialist job, i.e. SEM/EDX, FIB Circuit Edit, PFA Flow,AFM/SCM, delayering, SRP, etc within timeline independently S

• upport high impact jobs for IFKM (mainly) and IFX (globally) independently and being FA representative during the meeting D

• eliver a comprehensive, conclusive and good quality results and report for problematic wafers/samples which leading to root cause investigation P

• erform wafer and package sample preparation inclusive embedded cross-section, chemical delayering, XRAY,CSAM, Laser and Acid Decapsulation. R

• esponsible to execute KPIs and assigned projects. D

• emonstrate simple to medium of mental, analytical skills and problemsolving. Ability to evaluate the problems and provide the solution B

• usiness Process Owned, i.e. Construction Analysis business owner, ICO/FAR/Task Force. M

• anage the PFA Flow & ICO jobs submission and distribution C

• ompliance to lab instruction, VA, APA and SOP, safe chemical handling. Adhere to Environmental, Safety and ESD compliance regulations. P

• articipate in IFX user group meeting, i.e. Contributor for Best Practice Sharing T

• ool / Area Owner (any PFA tool / area). E

• nsure 5S in place while in the office and FA lab

Y

ou are best equipped for this task if you have:
P

• h.D/Master/Degree holder in Electrical/Electronics Engineering or Applied Science with major in Physics/Chemistry/Material Science 0

• -1 years of experience in semiconductor or failure analysis field. H

• as experience in any of FA methods as following: S

• EM/EDX, FIB Circuit Edit, Analytical Service, SRP, AFM/SCM, AES, TEM (level 2), package analysis including XRAY,CSAM, Laser/Acid Decapsulation, wafer and package sample preparation inclusive embedded cross-section, chemical delayering.

I



n our wafer production in Kulim we are producing more than 100.000 wafer each month. D

riving decarbonization and digitalization. Together. I

nfineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software. W

e are on a journey to create the best Infineon for everyone. T
his means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant\xc2\xb4s experience and skills. P