Engineering Manager

Malaysia, Malaysia

Job Description


MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference277370_1732264613Engineering ManagerJob descriptionOur client is a rapidly expanding Semiconductor company in Malacca. They are currently seeking an Engineering Manager who will oversee the areas of Die Bond, Plating, Dispensing, Testing.Key Responsibilities:

  • Leadership & Team Management: Lead a team of engineers and technicians, fostering a collaborative environment that promotes innovation, problem-solving, and high performance. Mentor and develop team members to reach their full potential.
  • Process Optimization: Manage and enhance die bonding, plating, dispensing, and testing processes to improve production efficiency, yield, and product quality. Implement best practices and drive continuous improvement initiatives.
  • Quality Assurance: Collaborate closely with the quality team to ensure all processes meet stringent quality standards and regulatory requirements. Identify and address quality issues proactively to maintain a high standard of product reliability.
  • Project Management: Plan, organize, and execute projects aimed at process enhancement, cost reduction, and equipment upgrades. Track project milestones, allocate resources, and ensure timely completion within budget.
  • Collaboration: Work cross-functionally with R&D, production, and supply chain teams to support product development, resolve technical challenges, and ensure smooth production workflows.
  • Data Analysis: Utilize data-driven approaches to monitor production metrics, analyze trends, and identify opportunities for improvement. Ensure that all equipment and processes operate within defined specifications and parameters.
  • Troubleshooting & Problem-Solving: Address technical challenges within the die bonding, plating, dispensing, and testing processes swiftly and effectively, providing technical guidance and hands-on support as needed.
  • Compliance & Safety: Ensure compliance with company policies, industry standards, and safety regulations in all engineering activities. Promote a culture of safety within the team and address any potential risks.
Skills & Experience Required:
  • Bachelor's or Master's degree in Engineering, Electronics, Material Science, or a related field.
  • Minimum of 5-7 years of experience in semiconductor manufacturing, with a focus on die bonding, plating, dispensing, and testing processes.
  • Proven experience in a leadership role within a manufacturing or engineering environment, preferably in the semiconductor industry.
  • Strong understanding of production processes, equipment, and materials used in die bonding, plating, and dispensing.
  • Demonstrated ability to lead and motivate a technical team.
  • Excellent analytical and problem-solving skills with a data-driven mindset.
  • Strong project management skills with the ability to handle multiple priorities and meet deadlines.
  • Proficiency in English; knowledge of other languages used in Malaysia (Mandarin proficiency would be an added benefit).
To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.Sign up for job alertsIf you are a human, ignore this field Create alertYou agree to ourShare this jobEngineering ManagerMalaysia Posted about 19 hours agoQuick LinksConnectWe are committed to Building Better Futures for the organisations we work for, the professionals we help, and our own employees.Agensi Pekerjaan Ambition Group Malaysia Sdn. Bhd.JTK Number: JTKSM 995Company Registration Number: 201301019088 (1048918-T)MalaysiaSuite 8.03 & 8.05, Level 8, The Gardens North Tower, Mid Valley City, Lingkaran Syed Putra

Ambition

Beware of fraud agents! do not pay money to get a job

MNCJobz.com will not be responsible for any payment made to a third-party. All Terms of Use are applicable.


Job Detail

  • Job Id
    JD1078380
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Malaysia, Malaysia
  • Education
    Not mentioned