Equipment Engineer

Kuala Lumpur, Malaysia

Job Description


  • In-charge for WB AOI & Wire Bonder.
  • Responsible for equipment incurred quality incident investigation & CAPA.
  • Maintain machine performance through preventive maintenance and predictive maintenance.
  • Monitor equipment performance key indicators (Downtime/MTBA/PM success rate & etc).
  • In-charge for new bonder installation, buyoff & qualification.
  • Responsible for equipment related document release & update (WI, EFMEA, PM & etc).
  • Involve in equipment quality, process & 5S audit.
  • Support department automation project at wire bonder & AOI.
  • Identify and mitigate risk areas where the equipment or the methodologies in maintaining the equipment can cause quality or productivity problems.
Requirements
  • Bachelor of Engineering (Hons) in Electrical / Mechanical / Mechatronic.
  • Minimum 2 years of working experience in AOI / wire bond.
  • Able to read, write and converse in English and Bahasa Malaysia.
  • Equipment experience with AOI (Cortex & InD) & KNS wire bonder (ICONN series & RAPID).
  • Able to do presentation to a big group of employees.
  • Experience in DMAIC, 5 Why, FTA analysis tool & EFMEA.
  • Strong knowledge in equipment stability (MTBA/MTBF, OEE & Equipment Cpk)
  • Have a good interpersonal skill & able to work independently with minimum supervision.
  • Power BI and/or SAP background will be an advantage.

NXP Semiconductors

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Job Detail

  • Job Id
    JD1048512
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Kuala Lumpur, Malaysia
  • Education
    Not mentioned