Perform electrical validation and fault isolation to products that failed test and finding the physical defects that associate with the electrical failure. Be able to clearly comment about the failure mode and mechanism.
Evaluating assembly, fab or substrate processes, material properties and mechanical characteristics of components to determine the root cause of failure.
Using analytical tools such as Parametric Analyzer (I/V analysis), Keithley meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, IRLC, mechanical & chemical sample preparation and others to understand the failure mode and mechanism.
Publishing analytical reports with established failure mechanisms, potential root causes and recommending corrective actions to prevent reoccurrence of problems.
Analyzing failure reports and recommending corrective action to prevent reoccurrence of problems.
Responsible to remove analytical barriers faced in new package technology and develop analytical techniques and metrologies for Q&R use.
Supporting new package transfer and responsible to proliferate best known methods and key learning to Assembly Test Manufacturing (ATM) sites.
Job Requirements:
Bachelor's degree or higher in
Material Science, Physics, Mechanical, or Chemical Engineering
, or equivalent.
Knowledge of analytical tools such as
Parametric Analyzer, Keithley Meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, and IR Imaging tools.
Strong analytical thinking and problem-solving skills.
Familiarity with
material analysis techniques
such as
FTIR, XPS, and ToF-SIMS
is an advantage.
Job Type: Contract
Contract length: 12 months
Pay: RM3,000.00 - RM3,500.00 per month
Benefits:
Opportunities for promotion
Professional development
Ability to commute/relocate:
Bayan Lepas: Reliably commute or planning to relocate before starting work (Required)
Application Question(s):
What is your expected salary?
Experience:
Failure Analysis: 2 years (Preferred)
Work Location: In person
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