Job Description

Perform electrical validation and fault isolation to products that failed test and finding the physical defects that associate with the electrical failure. Be able to clearly comment about the failure mode and mechanism. Evaluating assembly, fab or substrate processes, material properties and mechanical characteristics of components to determine the root cause of failure. Using analytical tools such as Parametric Analyzer (I/V analysis), Keithley meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, IRLC, mechanical & chemical sample preparation and others to understand the failure mode and mechanism. Publishing analytical reports with established failure mechanisms, potential root causes and recommending corrective actions to prevent reoccurrence of problems. Analyzing failure reports and recommending corrective action to prevent reoccurrence of problems. Responsible to remove analytical barriers faced in new package technology and develop analytical techniques and metrologies for Q&R use. Supporting new package transfer and responsible to proliferate best known methods and key learning to Assembly Test Manufacturing (ATM) sites. Requirements: Master\'s or Bachelor\'s degrees in Engineering\'s/Physics/chemistry or others relevant fields. Knowledge in analytical tools such as Parametric Analyzer (I/V analysis), Keithley meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, IR Imaging Tool. Strong problem solving and analytical skills. Knowledge in material analysis techniques such as FTIR, XPS, Tof-SIMS would be an added advantage

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