Job Description

Key Responsibilities:

Conduct

failure analysis (FA)

on assembly products to evaluate solderability integrity for both fresh assemblies and after environmental stress testing. Define and optimize

FA flows and methodologies

for different case types to ensure accuracy and efficiency. Prepare

detailed FA reports

, summarize findings, and assist engineering teams in identifying and resolving root causes of defects. Develop and validate

new FA processes, methods, and capabilities

to support new product introductions and emerging technologies.

Plan and execute projects

effectively, ensuring timely and cost-efficient delivery of results. Maintain the

Failure Analysis Laboratory

in compliance with internal quality systems and standards.

Qualifications:

Bachelor's or Master's Degree in

Electrical & Electronic Engineering

or

Materials Engineering

. Minimum

5 years of hands-on experience

in Failure Analysis (FA) within the semiconductor, electronics, or related industry. Familiarity with

IC and passive component structures and defects

. Understanding of

semiconductor and SMT assembly processes

and technologies. Knowledge of

memory product structures

and

test methodologies

. Proven experience in

technical FA reporting

and presenting analytical findings. Strong

communication, teamwork, and problem-solving

skills. Fluent in

English

(spoken and written). Prior FA experience in

IC or memory device analysis

is a strong advantage.

Technical Skills:

Proficient in FA instruments and techniques, including:
- 3D X-Ray, Ion Milling, CSAM, SEM/EDX, EBSD, FIB, TEM, TDR, Optical Microscopy,

Chemical Decapsulation, and Curve Tracer Analysis. Expertise in

solder joint and solder microstructure characterization

. Strong

analytical, troubleshooting, and documentation

skills. Ability to apply

advanced engineering principles

to solve complex technical problems independently.
Job Type: Full-time

Pay: RM8,000.00 - RM10,000.00 per month

Benefits:

Dental insurance Flexible schedule Health insurance Maternity leave Opportunities for promotion Parental leave Professional development Vision insurance Work from home
Application Question(s):

Do you have experience in solder joint and solder microstructure characterization? Do you have experience in performing in-depth failure analysis on electronic assemblies and components?
Work Location: In person