Intern Component Failure Analysis
Job Description
Job Summary:
We are seeking a motivated and detail-oriented intern to join our Component Failure Analysis team. This internship provides a unique opportunity to gain hands-on experience in material analysis and failure investigation of electronic components, particularly focusing on ceramic substrates. The successful candidate will work closely with cross-functional teams to identify root causes of component failures and contribute to the development of corrective and preventive actions.
Responsibilities:
Conduct reviews of cracked ceramic substrates and related component characteristics.
Investigate failures at both hybrid manufacturing and PCBA (Printed Circuit Board Assembly) process levels.
Perform material-level analysis and in-depth process studies to determine failure mechanisms.
Utilize Finite Element Analysis (FEA) tools to simulate stress and validate suspected root causes.
Propose corrective actions based on identified causes and recommend enhancements to material inspection methods.
Requirements:
Must possess or currently pursuing at least a Bachelor's Degree in Engineering (Materials, Mechanical, Electrical, or related disciplines).
No prior working experience required; training and guidance will be provided.
Willingness to work on-site in Penang Science Park.
Strong organizational and time management skills.
Excellent interpersonal and communication abilities.
Detail-oriented, analytical, and results-driven.
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Job Detail
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Job IdJD1114904
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationPulau Pinang, Malaysia
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EducationNot mentioned