Job Description

Detailed Description: Responsibility : The Global DFx Lead is responsible for managing and executing support for the DFM (PCA), DFA (mechanical), and DFF (PCB) engineers in the global region. The successful candidate will be responsibe for delivering DFM & DFA training and evaluating the qualification work submitted by trainees, responding to technical questions on DFx, working with the Celestica technology development teams and gathering data from the sites to develop and support updates to the DFx Guidelines, and developing, testing, and implementing continuous improvements to the DFx processes, including updates to the Valor ERFs, manual Checklists, tolerance analysis, etc. Main Objectives % Time DFx Guidelines updates (primarily DFM, but also DFA, DFF, DFT) 30% DFM & DFA tool & process updates (checklists, Valor ERFs, BDI tool, training material, tolerance analysis, etc.) 30% DFx training & qualification (DFM, DFA, DFF) 15% Special projects, regional/site technical support, develop strong regional DFx community 10% Additional Objectives Participate with other senior technology experts from around the world in shaping 5% Celestica\'s overall DFx Strategy world wide and enhancing the DFx capability. Assist with emergency issues as they arise within Celestica\'s global operations network and/or with Celestica\'s customers. 5% Promote Celestica\'s engineering leadership through industry consortia, technical 5% papers/publications, industry standards groups, etc. Total: 100% Requirements: Educational- Educated to degree level in an appropriate electronics/engineering discipline Experience - 10 years+ experience within a manufacturing engineering operational role and /or process application engineering development role Experience and proven abilities in - project management - working with employees in several different countries and time zones - working with customers - driving continuous improvement and best practices Background in one of the following disciplines within an electronics producing company: Manufacturing Engineering, Process Engineering, Equipment Engineering, or similar. In depth knowledge and understanding in the following technical areas: printed circuit board (PCB) assembly processes (SMT, wave etc...), materials (SnPb and Pb-free) and equipment. mechanical and system assembly processes (fasteners, adhesives, plastics, press-fit, bearings, belts etc...) DFM and DFA principles and guidelines analysis tools for DFM and DFA, e.g. Valor, Boothroyd & Dewhurst (BDI) industry and quality standards including those for SnPb and Pb-free materials and workmanship materials and components used in the construction of printed circuit assemblies (PCAs) statistical techniques and design of experiments Ideally 6-sigma Green Belt or Black Belt certified requirements of factories servicing different operating models (consumer, high mix low volume, medium mix medium volume) core IT platforms (Matrix, Aspect, SAP, MS Excel, Word, PowerPoint, ) Basic familiarity with: PCB & mechanical design process and tools, and awareness of common design challenges PCB fabrication processes and materials PCB & PCA reliability issues & test methods mechanical part fabrication processes (plastics, sheetmetal) tolerance analysis theory and tools stencil design theory and tools structural test techniques (ICT, AXI, AOI, API) Adobe Framemaker (Guidelines written tool) Ability to work independently with a minimum of supervision / guidance on complex technical issues and/or in diversified teams. Ability to make use of shared people resources and influence them to support your projects. Willing to perform some travel. Skills: Understanding of adult education principles, communication techniques and training course design. Outstanding English skills (spoken and written). Experience with another language would be an asset (Mandarin, Malay, Thai, and Japanese). Ability to effectively communicate with a variety of internal and external stakeholders including senior leaders Excellent organization skills, presentation skills and leadership skills. Demonstrated ability to be resourceful, leverage experts, and go beyond barriers to solve technical challenges Others- Preferred the incumbent possess the above specified educational, experience and skills but those incumbents met the partial requirement would be considered.

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