Maintenance Technician (die Bond/wire Bond/avi/encapsulation/plating/sawing/testing)

Melaka, M04, MY, Malaysia

Job Description

Responsibilities :



Carry out routine tasks of a planned maintenance course such as undertaking simple servicing, adjustments and alignments of mechanical elements. Install and adjust mechanical, pneumatic, hydraulic, electrical and electronic machines or parts of machines. Fabricate simple machine parts using conventional precision engineering machines, hand tools and assembly processes. Mount and secure different types of electrical motors, sensors and switches onto assemblies and sub-assemblies. Diagnose faults using test equipment for electrical, electronic, pneumatic and hydraulic systems including. Perform simple integration, installation, calibration, maintenance, commissioning, documentation and troubleshooting of automated production equipment. To set the machine parameter as per specification.
Requirements :

Candidate must possess at least a Diploma in Electronics Engineering, Mechanical Engineering or equivalent. Minimum 1 year working experience in semiconductor industry. Fresh Diploma Graduates are encouraged to apply.
Job type : Full-time, Permanent

Salary : RM1,800.00 - RM 3,000 per month

Job Type: Full-time

Pay: RM1,800.00 - RM3,000.00 per month

Benefits:

Gym membership Health insurance Maternity leave Parental leave
Education:

Diploma/Advanced Diploma (Preferred)
Experience:

Technician: 1 year (Preferred)
Work Location: In person

Beware of fraud agents! do not pay money to get a job

MNCJobz.com will not be responsible for any payment made to a third-party. All Terms of Use are applicable.


Job Detail

  • Job Id
    JD1298928
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Melaka, M04, MY, Malaysia
  • Education
    Not mentioned