Coordinate engineering activities with packaging and testing factories; interface with test suppliers on product test development and engineering matters.
Manage the NPI process, oversee design, manufacturing, and testing workflows, and drive yield improvements. Ensure CP and FT meet mass-production standards for manufacturing criteria, yield rate, and test coverage.
Analyze production anomalies and customer-reported abnormal products; support CQE in providing handling recommendations and solutions.
Track engineering lot progress, coordinate failure analysis for pilot runs, propose improvement plans, and participate in product reliability verification.
Prepare and maintain product packaging documentation.
Knowledge and Skill Requirements
Bachelor's degree or above in Microelectronics, Semiconductor Physics, Electronic Engineering, or related fields.
Over 3 years of experience as a PE or PIE in wafer fabs or packaging factories, with strong familiarity in IC manufacturing and packaging processes. Experience in IC NPI project management or design house PE roles is preferred.
Familiar with semiconductor quality requirements and standards.
Strong data analysis and logical reasoning skills; proficient in common data analysis tools; knowledgeable in IC failure analysis methods and equipment.
Strong execution, communication, and organizational capabilities, with excellent coordination skills and teamwork spirit.
Fluency in Mandarin and English is preferred.
Job Type: Full-time
Pay: Up to RM8,000.00 per month
Benefits:
Opportunities for promotion
Professional development
Work Location: In person
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