Req ID: 127649
Remote Position: No
Region: Asia
Country: Malaysia
State/Province: Johor
City: Senai
Summary
We are looking for a highly experienced Senior Engineer specializing in Printed Circuit Board Assembly (PCBA) to drive and execute process improvements with a strong focus on New Product Introduction (NPI), preferably from High-Mix Low-Volume (HMLV) manufacturing environments.
The ideal candidate will leverage deep technical expertise to optimize PCBA processes, ensure scalable and high-quality solutions, and champion continuous improvement in yield, quality, and cost efficiency as an individual contributor and technical leader.
Detailed Description
Performs tasks such as, but not limited to, the following:
Manufacturing Process Engineering & NPI Execution
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