Memory Design Engineer

Malaysia, Malaysia

Job Description


You will be part of Intel Advanced Design Organization (AD) within Design Enablement (DE) focused on pathfinding and development of advanced memory technology and circuits to enable best-in-class memory collateral/IP and product design across all generations of Intel process technology. The Role: As a member of our team, your responsibilities will include (but not limited to): Memory pathfinding activities and power performance area (PPA) optimization through design technology co-optimization (DTCO) product/design enablement. Memory bitcell and complex periphery IC layout and automation Memory array/IP design, memory circuit innovation, testchip design/execution/validation. Pre/post-Si validation/debug to enable yield and parametric tracking/ramp.Qualifications The candidate must possess minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork class research and or relevant previous job and or internship experiences. Minimum Qualifications: You should have Bachelor /Master in Electrical Engineering, Computer Engineering, Computer Science, or other related Electrical Scientific STEM field. Proficient in TCL, Perl or Python programming language. Unix/Linux operating system Preferred Qualifications: Ability to work in a fast-paced, collaborative, and often intense project schedule. Excellent communication and interpersonal skills, a good team-player as well as able to work independently. Creative mind and self-motivated. Analytical problem solving and multitasking. Able to do pathfinding or research independently to find solutions. #designenablementInside this Business Group As the world\'s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in theTechnology Development and Manufacturing Groupare part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore\'s Law to bring smart, connected devices to every person on Earth.Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: Working Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

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Job Detail

  • Job Id
    JD925400
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Malaysia, Malaysia
  • Education
    Not mentioned