Job Description

:WHAT YOU DO AT AMD CHANGES EVERYTHINGWe care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences \xe2\x80\x93 the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world\xe2\x80\x99s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.AMD together we advance_THE ROLE:Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip Assembly/Advanced Packaging/Bumping manufacturer on delivering key performance indices in terms on yield, excursion free and enabling new capabilities.THE PERSON:The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good presentation skills. Good in writing and speaking in English. Last but not least, be able to cope with stress!KEY RESPONSIBILITIES:

• Responsible for InFO, HDCL, CoWoS, WLFO, FCBGA, LGA and Chiplet package Manufacturing readiness for New Product bring up at manufacturing site.
• Drive assembly process baseline standardization and continuous improvement.
• Responsible for packaging yield, quality, cost and operation productivity improvements and sustaining activities.
• Responsible for the packaging interaction activities among assembly, bump, 3D IC, HBM and wafer fab, wafer sort, Functional Test and Mark/Pack.
• Drive Assembly manufacturer to enhance process, equipment & material capability for future generation/technology products
• Co-work with Packaging BU on NPI and Ramp Up readiness at manufacturing site. Proactively follow up task assignments and report status timely to stakeholders.
• Responsible to manage performance of assembly manufacturing site/supplier regarding yield & quality, out of control lot disposition, and any outliers with close loop on reporting.
• Drive external manufacturer on issue resolution and issue prevention
• Timely execution of special work requests, with comprehensive reports.
• Monitor performance of external manufacturing site regarding yield, out of control lots disposition, and any outliers reporting from internal or external parties.
• Plan and execute change management from internal or external parties.
• Proactively drive towards continuous improvement in process simplification and quality enhancement, be it in internal and external environment.
• Provide disposition to out-of-control lots and present for Material Review Board (MRB).
• Occasionally to support on site audit and travelling.
• Assist in additional duties as deemed fit by supervisor.

PREFERRED EXPERIENCE:

• Strong knowledge in Flip chip Assembly process and experience in InFO or 2.5D/3D Bump/TSV/Packaging or WLFO process engineering with min total 10 years assembly work experience.
• Possess InFO, Chiplet packaging, 2.5D/3D TSV/Packaging, Flip Chip BGA/LGA process knowledge and Chip-Packaging Interaction knowledge.

• Strategic supplier management experience and highly motivated self-driven individual team player with the demonstrated ability to independently complete complex engineering tasks on/ahead of time/Lead & Drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment.

• Familiar with tools (JMP, minitab, failure analysis knowledges, package reliability knowledges) and industry standard (ESD, Jedec, Automotive).

ACADEMIC CREDENTIALS:

• Bachelor/MS degree in Mechanical or Material or Chemical Engineering

LOCATION:Penang#LI-LL1Benefits offered are described: .AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants\xe2\x80\x99 needs under the respective laws throughout all stages of the recruitment and selection process.

Advanced Micro Devices