Job Description

OUR STORY

At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.


When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!


Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation - whilst unlocking your own potential.

Responsibilities:

To develop & to industrialize New material / New process (Molding / Trim & Form / Solder Ball Attach / Package Saw) for new packages / products (QFP HD SHD / BGA / PSSO / PSO / HiQuad / SOIC / SSOP) To support qualification lot and engineering lot to meet time-to market for new packages / new products. To review and update Process Specification, FMEA, OCAP and Process Control Plan. To support EOL process optimization during major quality complaint.

Requirements:

Master's or Bachelor's Degree in Mechanical Engineering / Material Science / Electrical Engineering / Electronics Engineering or Equivalent Engineering field. Minimum 2-3 years of working experience on EOL processes. Experience on BGA packages will be added advantage. Strong technical knowledge on process and material know-how Skill in Design of Experiment. Skill in SAS-JMP will be an added advantage. Skill in analytical trouble shooting. Know FMEA, 8D and other QA tools. Good inter-personal skills and able to work well under pressure .
Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future!


To discover more, visit st.com/careers