Malaysia
Job details Posted 02 November 2022 SalaryNegotiable LocationMalacca Job type Discipline ReferenceBBBH253555_1667393737
Packaging Development Engineer (Semiconductor)
Job description
Our client is a world-leading chip manufacturer from the U.S. Due to increasing demand from their customers worldwide, they are looking to add a Packaging Development Engineer to join their team.
Responsibilities
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