Job Description

Change the world. Love your job.

As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy. Put your talent to work with us as a Packaging engineer - change the world, love your job!

Responsibilities may include:

Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology Defining simplified manufacturing process sequence for different components attach Managing multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product RTM including project documentation Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs Enabling TI power modules package competitiveness through adopting the industry latest greatest capabilities in the high-volume manufacturing environment
QUALIFICATIONS

Minimum requirements:

Bachelor's degree in Mechanical Engineering, Physics, Material Science, or a related field of study Minimum 8 years-experience in the semiconductor field Expert level experience in mold process development for power module. Package layer design expertise such as structural configuration, material selection and process flow design Hands on skills in operating machines and knowledge to down-select material, process optimization and yield improvement

Preferred qualifications:

Knowledge in trim & form and package singulation are added advantage Ability to engage with a geographically diverse team with a strategic vision to drive a complex technology roadmap Knowledge of IC packaging End of Line (EOL) processes, including understanding of Design for Manufacturability (DFM) constraints Experience in multi-process coordination and optimization (integration between SMT and back-end packaging processes) Ability to establish strong and collaborative relationships with stakeholders, global design & manufacturing teams and component/material/substrate supplier to meet on-time execution Broad and deep technical understanding of power module System-in-Package (SiP) experience, including Exposed Inductor integration solutions is added advantage Detailed understanding with experience of manufacturing process and demonstrated capability of taking new technology concepts to high yield, low cost and high-volume production Familiarize on module package reliability requirement and module package defect criteria. Knowledge in FMEA methodology, process control plan, statistical analysis, SPC and DOE methodology. Skilled in JMP statistical analysis software is an added advantage Good at Microsoft software - power point, excel and outlook. Experience in packaging development, with expertise in leaded module package and passive component integration Experience with assembly of power modules packaging, substrate design and reliability requirements Hands-on experience with flip chip, chip shooter or any other component attached equipment. Components are referring to resistors, capacitors, inductors, clips Project management experience in semiconductor industry specifically in Assembly Test or SMT Operation Key personal characters - trustworthy, inclusive, innovative, competitive, result-oriented
ABOUT US

Why TI?

Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.





Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.



If you are interested in this position, please apply to this requisition.


TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.
JOB INFO


Job Identification
25000534
Job Category
Engineering - Product Dev
Posting Date
10/23/2025, 02:46 AM
Apply Before
10/31/2025, 04:00 AM
Degree Level
Bachelor's Degree
Locations
MELA Batu Berendam Free Trade Zone, Melaka, 75350, MY
ECL/GTC Required
Yes