Plating Process Development Engineer M/f
Job Description
Job description . To setup plating (Cu/Tin) process. . To develop and to industrialize Cu plating process with vertical and horizontal equipment for new packages, introduce materials to meet the quality, yield, and mission of new application. . To support assembly of engineering sample for new packages or new technologies. . To characterize assemble plating process and materials. . To generate and update process specifications, SOP, FMEA and process control plan. . To provide technical support when there are critical quality concerns related to assembly EOL material / process. Profile . More than 3 years working experience. . Masters/Bachelor\'s Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent. . Equipped with statistical data analysis, analytical and problem-solving skills especially at plating process. . Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is not etc. . Ability to anticipate issues and challenges and resolving them quickly. Good knowledge and skills in production area. . Practice high performance behavior and together work as Team in executing projects & strive for excellent.
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Job Detail
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Job IdJD989466
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationMuar, Johor, Malaysia
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EducationNot mentioned