Job Scope:
Develop and maintain end-to-end cost models for semiconductor products (wafer, die, assembly, and test).
Analyze yield, process time, and material usage to determine true manufacturing cost.
Perform cost variance and margin analysis between standard and actual costs.
Potentially will support new product introductions (NPI) by preparing early cost estimates and validating BOM and process routings.
Conduct "what-if" simulations to evaluate cost impact of process, yield, or design changes.
Collaborate with process, yield, and product engineers to identify cost-down and efficiency opportunities.
Prepare regular cost roll-up reports and dashboards for management.
Ensure compliance with financial accounting standards (GAAP/IFRS) and internal cost policies.
Requirements:
Bachelor's Degree in Engineering (Electrical, Electronics, Industrial, or Manufacturing).
Minimum 5 years' experience in product costing or cost engineering within the semiconductor or electronics industry.
Strong understanding of wafer fabrication, assembly, and test cost drivers.
Proficiency in ERP systems (SAP / Oracle) and advanced Excel modelling.
Hands-on experience in analyzing yield, test time, and package cost impact.
Excellent analytical, problem-solving, and cross-functional communication skills.
Nice To Have :
Experience in Power BI / Tableau / VBA for data visualization and reporting.
Familiarity with statistical process control (SPC) and cost optimization projects.
Knowledge of outsourced assembly and test (OSAT) costing.
Professional certification (CMA / CPA / CIMA) is an advantage.
Job Type: Full-time
Pay: RM7,000.00 - RM9,000.00 per month
Work Location: In person
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