Job Description

Drive Technology Integration activities to ensure the package fulfil the requirements in the aspect of Process Interactions.

In your new role you will:

• Execute PBC and TPC assessment within A-project development.
• Driver of Package Technology DFMEA for A-project.
• Owner of Risk Interaction assessment and mitigation work packages.
• Responsible for the integration of unit processes (BOM and Process) in package platform - Risk assessment, study interactions with other processes and process flow.
• Key working partner for FE in FE/BE for new FE technology, process interaction and integration topics.
• Support Pre development for new Chip technology / new package development within development platform.

Your Profile
You are best equipped for this task if you have:

• Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, Physics).
• 8 years of relevant working experience in IC/semiconductor environment.
• Experience in Semiconductor Packaging, Assembly and Test.
• Excellent technical knowledge of BE processes and materials in plastic packages and interaction to the different functions (interaction between FE-BE / BE-BE processes).
• Excellent technical knowledge of Process and Equipment Engineering.
• Good knowledge on the internal package analysis and first level reliability.

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
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Skills Required