Principal Engineer Process Wire Bond
Melaka, Malaysia
Job Description
Location: Melaka
Job ID: HRC0775119Job description
In your new role you will:
- To sustain, improve the process in order to deliver products to customers at committed functionality, reliability, time, volume and cost.
- Ensure compliance of control plan deployment and quality controls are met; understanding of key parameters definition and controls.
- Knowledge in FOL process engineering specializing in Wire Bond.
You are best equipped for this task if you have:
- Bachelor\'s degree in Mechanical/ Electrical / Electronics /Microelectronics / Mechatronics / Materials Science / Semiconductor Technology
- More than 10 years related experience in FOL Process Engineering or in Semiconductor Assembly Manufacturing background.
- Statistical data analysis, analytical and problem solving skills.
- Ability to anticipate issues and challenges and resolving them quickly
- Expert in prosses knowledge and skills in manufacturing process &some equipment knowledge.
- Systematic Problem Solving methodology e.g. 8D, DMAIC, Process Mapping, FTA, Fish Bond
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant\xc2\xb4s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.Does this sound like just the right challenge for you? If so, we look forward to getting to know you!(It only takes 90 seconds)
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Job Detail
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Job IdJD1028690
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationMelaka, Malaysia
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EducationNot mentioned