Process Development Staff Engineer (Die Attach/Wire Bond)
Bayan Lepas, Penang, Malaysia - OSRAM OS Penang
What we expect
Develop Die Attach & Wire Bond process for mass production to handshake with operation team per project targeted timeline.
Support and contribute in Die Attach & Wire Bond technology building block / roadmap.
Support new product pre-series and ramp-up.
Support post Q5 product quality, yield and FAR topics.
Who we are looking for
Bachelor or Master degree in engineering or relevant field.
5 - 10 years in semiconductor Die Attach & Wire Bond process engineering field.
5 - 10 years in Die Attach & Wire Bond process development.
DA & WB process egnineering knowledge & hands on skillset in semiconductors or LED manufacturing processes.
Knowledge in process development step and statistic.
ams OSRAM is an Equal Employment Opportunity Employer. Diversity, equity and inclusion is strongly established in our corporate culture and we firmly believe it makes us more successful as a company. All qualified applications will receive consideration for employment regardless of ethnic, national or social origin, gender, gender identity, sexual orientation, color, religion, age, physical and mental abilities.
Contact
Nurul Ain Rosli will be happy to answer any questions you may have.
E-Mail: nurul-ain.rosli@ams-osram.com
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Job details
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