Job Description

Job Summary:

The COB Sub-Assembly Engineer is responsible for developing, implementing, and optimizing Chip-on-Board (COB) processes, including Die Bonding and Wire Bonding, for electronic sub-assembly manufacturing. This role plays a key part in ensuring product reliability, supporting new product introduction, and continuously improving yield and quality in a high-precision production environment.

Job Responsibilities:

1. Process Development & Production Support

Develop Die Attach (DA) and Wire Bond (WB) processes for mass production according to project timelines. Support COB process roadmap and contribute to technology building blocks. Assist in pre-series builds and new product ramp-up. Provide technical support for quality, yield, and failure analysis (FAR) post-Q5.
2. Process Control & Documentation

Monitor production yield and prepare performance reports for internal and customer reviews. Create and maintain Work Instructions (WI) and Visual Aids (VA) to support operators. Set up machines and process parameters for new model introductions. Train technicians and operators on process knowledge and best practices. Apply Design of Experiments (DOE) methodology for process improvement.
3. Equipment & Tooling

Operate and maintain COB-related machines such as:
o ficonTEC AL500 Alignment System

o ASM Aero Wire Bonder

o F&K and HESSE Ribbon Bonders

o Nordson Plasma System

Design custom fixtures and tools to support product requirements.
4. Quality & Continuous Improvement

Use quality tools such as QC 7 Tools, FMEA, SPC, 8D, and 5 Why for root cause analysis. Conduct electrical, thermal, and visual inspections to ensure product reliability. Support internal and external audits; implement corrective and preventive actions.
5. Cross-Functional Collaboration & Cost Control

Collaborate with electrical, mechanical, and manufacturing teams to meet product requirements. Optimize production efficiency and reduce costs while maintaining quality standards. Stay updated with COB and microelectronics packaging advancements and introduce improvements where applicable.
Job Qualifications:

Bachelor's degree in Electrical / Electronics Engineering or related field (Master's preferred). Proven experience in COB sub-assembly or microelectronics packaging. Hands-on knowledge of Die Attach and Wire Bond processes. Experience with design tools (AutoCAD, Altium, Cadence). Strong problem-solving and analytical skills. Effective communication and team collaboration abilities. Familiarity with cleanroom protocols and industry regulations.
Work Environment:

This role is typically performed in cleanroom or high-tech manufacturing environments. Hands-on work with sensitive electronic components and precision machinery is required.

Job Type: Full-time

Benefits:

Free parking Health insurance Maternity leave Meal allowance Parental leave
Work Location: In person