Job Description

JOB SUMMARY

• Execution of all necessary reliability activities to ensure reliability of the wafers produced in the fab.

MAJOR RESPONSIBILITIES

• Execute the assigned reliability testing activities, from the test request review, wafer archive, test plan creation, test execution, data analysis, and report preparation according to job responsibility matrix.
• Execute/Support new equipment installation and tool release procedure.
• Execute/Support test capacities planning and long-term forecast.
• Maintain reliability laboratory 6S.
• Support monitoring of ESD (execution of routine check for assigned staff), humidity and temperature.
• Assist equipment preventive and corrective maintenance including calibration and GR&R.
• Create/maintain equipment work instruction, specification, and procedure as well as records.
• Assist tracking of the spare parts, probe card and burn-in boards as well as laboratory budgeting. Maintaining the record for tool owners or assigned staff.
• Ensure monthly reporting on equipment indices and track the equipment usage time.
• Work with Reliability colleagues in other X-FAB sites to support test capability not available in Kuching.
• Perform training to trainee.
• Manage the outsourcing activities and vendors on packaging and external testing activities.
• To contribute towards the achievement of the EHS objectives by complying to the EHS policy and participating in the implementation of EHS management system.
• To contribute towards the achievement of quality objectives by complying to the quality operating system and participating in continuous improvement activities.
• Any other assignments deem fit that shall be given from time to time.
• Refer to job responsibility matrix for detail job scope.

Job requirements

POSITION REQUIREMENTS

• Master/Bachelor degree of Engineering/Science or Diploma of Engineering/Science.
• Fresh graduate are encouraged to apply
• Preferably working experience in foundry / test environment.
• Experience in semiconductor or electrical testing is an advantage.
• Skills/Competencies:

Behavioral Competencies

• Good administration skills - planning/organizing/co-ordination & documentation
• Good communication skills - fluent in English, written and spoken
• Good interpersonal skills - to deal with people of all levels
• Teamwork and collaboration skills

Technical/ Functional Competencies

• Computer literacy in Microsoft Excel, Word, Power Point
• Facilitation and presentation skills
• Knowledge in device physics related to IC failure mechanisms
• Analytical skills with data and plots

Application info

Interested candidates, please submit your application or send your comprehensive resume with expected salary to hr.kch@xfab.com

Contact person: Jesslyn Ling
or online at: