Job Description

In your new role you will: Managing package development execution within product/technology development according to project milestone, quality & cost requirements. Project complexity could be from Class E up to Class C. Aligned with chip/system development, test engineering for all technical, cost and quality aspects during project phase. Support Package Definition group to ensure package platformcomplexity, product requirement and customer commitment are met. Involved in problem solving and trouble shooting of development issues. Responsible for samples, qualification build-up & transfer into manufacturing engineering. Communication channel of dedicated project in BE to requestor (e.g. Project Owner, PJM of Product Line, Package group PCK of Product Line, BE Management, Steering committee). Responsible for regular KLUSA reporting and milestone release in NPI Tool Reporting project progress to Project Owner / PJM of PL and/or development board in BE OSAT Your Profile You are best equipped for this task if you have: Masters/Bachelor\'s Degree in Engineering, Physical Science or any equivalent field. At least 5 years above of relevant working experience and4 years of leading projects. Experience in semiconductor R&D in packaging group and managing project Good project management knowledge in terms of project initiation, planning and closing including reporting and documentation Analytical mind and high initiative to challenge him/herself and the team to move the next level of competency. Experience in analytical tool, e.g. Surface analysis, material characterization, DoE, D/PFMEA, 8D and simulation knowledge will be an added advantage Experience in IP management, e.g. patent filing. Certification on PMP, IPMA C, 6SIGMA are value added Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.

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