Job Description

Job Summary:

• Responsible for the design, development, execution, and/or implementation of packaging product, structures, or assembly process technologies. Investigates the feasibility of applying scientific and engineering principles and emerging technologies and capabilities to potential semiconductor packaging and assembly process offerings. Then, effectively develops or designs the implementation of these into manufacturing. Maintains substantial knowledge of state-of-the-art principles and theories and may contribute to scientific literature and conferences. May also participate in development of patent applications. Maintains an understanding of the semiconductor market and effectively translates market requirements to packaging.
• Collaborate with NXP internal assembly sites and OSATs to qualify product package solutions.
• Manage the package process using industry standard project management tools.
• Develop solutions by working closely with Package Innovation teams (Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing).
• Address and solve materials and processing issues that may occur during the development process.
• May involve international travel to package assembly sites and NXP suppliers.

• M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering or Electrical Engineering
• 3-5 years of experience in Semiconductor Packaging development role
• Working knowledge of various IC packages like QFP, QFN, BGA, FCBGA, FCCSP, WLCSP and FOWLP is required.
• Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.
• Knowledge of Statistical Analysis and Design of Experiment is a plus.
• Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.