Job Description

In your new role you will: Perform t echnical expert for lead frame / packing material in packagedevelopment projects. Perform design, drawing and specification for lead frame based on design guideline, assembly rules and ensure design for manufacturing, quality and cost. Collaborate with internal and material supplier on packing material design, specification and selection Drive lead frame / packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM, etc). Liaise with SQM and supplier to ensure fulfilment of quality requirement / FAI for lead frame / packing material and qualification release. Establish design guideline / requirement for lead frame / packing material specification. Generate technical papers / journals and patents related to lead frame design / package design that enhances technical value. Provide support in incoming material quality, work with suppliers /internal to resolve technology / quality issue, improvement programs, etc. Your Profile You are best equipped for this task if you have: Bachelor\'s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) At least 5 years of working experience in semiconductor assembly and packaging development Relevance experience in LeadFrame / Packing Material is preferred. Technical / Functional Competencies: Lead Frame design / packing material development & qualification Drafting / desigining (2D/3D) Lead Frame using AutoCAD / Inventor Knowledge in material physics / properties for Lead Frame and packing material GD&T knowledge / material specification definition Analytical and problem solving skills Basic semiconductor packaging, assembly and test Material development, analysis, qualification and reliability Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.

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