Drive Technology Integration activities to ensure the package fulfill all requirements in the aspect of Process Interaction. Key working partner for FE colleagues for new FE technology.
Be the driver of Package Technology DFMEA
Be the owner of Risk Interaction assessment and mitigation work packages
Integration of unit processes (BOM and Process) in package platform - Risk assessment, study interaction with other processes, process flow
Support Pre development for new Chip technology.
Be the driver/team member for 8D/problem solving for interaction issues
Your profile You are best equipped for this task if you have:
At least 5 years of working experience in IC/semiconductor environment.
Semiconductor Packaging, Assembly and Test knowledge.
Good aptitude for communication, collaboration, negotiation and solution finding
Experience in 8D & T6s methodology.
Driving decarbonization and digitalization. Together.
Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.
We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant\xc2\xb4s experience and skills. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Does this sound like just the right challenge for you? If so, we look forward to getting to know you!