Senior Engineer Package Technology
Job Description
In your new role you will: Drive Technology Integration activities to ensure the package fulfill all requirements in the aspect of Process Interaction. Key working partner for FE colleagues for new FE technology. Be the driver of Package Technology DFMEA Be the owner of Risk Interaction assessment and mitigation work packages Integration of unit processes (BOM and Process) in package platform - Risk assessment, study interaction with other processes, process flow Support Pre development for new Chip technology. Be the driver/team member for 8D/problem solving for interaction issues Your Profile You are best equipped for this task if you have: Bachelor\'s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) At least 5 years of working experience in IC/semiconductor environment. Semiconductor Packaging, Assembly and Test knowledge. Good aptitude for communication, collaboration, negotiation and solution finding Experience in 8D & T6s methodology. Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.
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Job Detail
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Job IdJD1016492
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationMelaka, Malaysia
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EducationNot mentioned