Senior Engineer Unit Process Development Wire Bond

Melaka, Malaysia

Job Description


In your new role you will: Responsible for the technical handshake and knowledge transfer to Operation. Support prototype and development samples build. Generate and update relevant documents, e.g., Process Specification, PFMEA, DFMEA, OJTI, T32, PDR. Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in Development projects. Technical lead for the task force and complex problem-solving team using Statistical and analytical tools, e.g. SPC, APC, DOE, 8D, FMEA, DFMEA, etc. Identify and develop new Process technology and improve Process capability to meet new requirements from Business divisions. Support the definition of Process technology, material, machine and tooling. Provide technical guidance/buddy to other engineers and the project team. Initiating, generating and driving IP ideas based on reading and research. Your ProfileYou are best equipped for this task if you have: Masters/Bachelor\'s Degree in Engineering or relevant course Minimum 8 years of working experience in the semiconductor manufacturing industry. Hands-on solid knowledge and skills in assembly, focusing on Interconnect processes specific to wire bonding (both Ball and Wedge bond) Analytical and problem-solving skills. Material science and chemical engineering know-how. Analytical equipment knowledge. Statistical data analysis including the design of the experiment. Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.

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Job Detail

  • Job Id
    JD907625
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Melaka, Malaysia
  • Education
    Not mentioned