In your new role you will: Wire Bond expert, responsible to achieve robust and auto-pilot processes Sustains and continuously improves qualified technologies in volume production with regards to stability, quality, productivity and yield. Supports development of new technologies and ensures smooth take-over into volume production and integration into manufacturing environment. Accountable and drive for 8D closure of FAR, MRB, DDM and SDCAR Leading and participating in yield & quality improvement and cost reduction activities As a technical expert in new material, process and method qualification Your Profile You are best equipped for this task if you have: Bachelor degree in Electronic, Mechanical or related Engineering More than3 years related experience in Assembly packaging or Semiconductor manufacturing background Experience inWire Bond Process Data Analysis (Statistical methods, data mining, etc) First level reliability (Knowledge of various failure modes, knowledge of application and respective reliability requirements and test standards) FSI (Front Side Interconnect) Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.
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