Senior Engineer Unit Process Engineering Wire Bond
Melaka, Malaysia
Job Description
Location: Melaka
Job ID: HRC0752317Job description
In your new role you will:
- Wire Bond expert, responsible to achieve robust and auto-pilot processes
- Sustains and continuously improves qualified technologies in volume production with regards to stability, quality, productivity and yield.
- Supports development of new technologies and ensures smooth take-over into volume production and integration into manufacturing environment.
- Accountable and drive for 8D closure of FAR, MRB, DDM and SDCAR
- Leading and participating in yield & quality improvement and cost reduction activities
- As a technical expert in new material, process and method qualification
You are best equipped for this task if you have:
- Bachelor degree in Electronic, Mechanical or related Engineering
- More than 3 years related experience in Assembly packaging or Semiconductor manufacturing background
- Experience in Wire Bond Process
- Data Analysis (Statistical methods, data mining, etc)
- First level reliability (Knowledge of various failure modes, knowledge of application and respective reliability requirements and test standards)
- FSI (Front Side Interconnect)
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant\xc2\xb4s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.Does this sound like just the right challenge for you? If so, we look forward to getting to know you!(It only takes 90 seconds)
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Job Detail
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Job IdJD1026734
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationMelaka, Malaysia
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EducationNot mentioned