Job Description

OverviewThe Microsoft Silicon team is transforming the ways people communicate, create, and collaborate through the devices and components we develop. We\xe2\x80\x99re a growing team of engineers on a mission to develop revolutionary designs and provide leading edge silicon device solutions to power Microsoft computer and datacenter requirements. Microsoft systems including Azure, Xbox and HoloLens incorporate our internally developed silicon components. Our team is creative and resourceful; we value growth and learning. We want to amplify your abilities so you can do your best work. Join us, and together we\xe2\x80\x99ll turn groundbreaking hardware designs into reality!We are seeking a Senior IC Package Engineer to work in Microsoft Azure hardware engineering team!Microsoft\xe2\x80\x99s mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.Responsibilities:The Senior IC Package Engineer will be responsible for providing support, expertise and insight to the Silicon device development team through the entire life cycle of the product. In this role, you will be responsible for supporting the design and implementation of new custom Silicon devices, evaluation and recommendation of new packaging technology, Substrate design support, device/package qualification, supplier assessment, manufacturing bring up, and driving quality/reliability in development and production.Specific responsibilities to include:

• Package Supplier Manufacturing Operations, Quality and Reliability
• Drive supplier assessments and manage suppliers through definition, development, qualification (NPI) and production.
• Manage supplier in external assembly/bumping manufacturer to ensure parts are assembled and manufactured to product specification and deliver to KPIs.

MRB handling and management for excursion coming from Foundry, OSAT, System Integrator and Customer Returns (RMA). * Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options.

• Assess and characterize the reliability of Integrated Circuits (IC) packages.

Package Development Execution

• Drive package technology solutions for chiplet architecture with advanced packaging.
• Define, design and develop test vehicles to validate Silicon, Package, System performance.
• Support substrate design working with suppliers and internal teams
• Design and develop package and assembly drawings to support the manufacturing.
• Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
• Drives the execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry best practices, and lessons learned from teams working across multiple product lines.
• Drives engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.

This role requires the candidate to have both experiences mentioned above.Embody our Culture and ValuesQualifications:Required Qualifications:

• 7+ years of related technical engineering experience

• OR Bachelor\'s degree in Electrical Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering, or related field AND 5+ years technical engineering experience or internship experience.
• OR Master\'s degree in Electrical Engineering, Electrical Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering, or related field AND 3+ years technical engineering experience or internship experience.
• OR Doctorate degree in Electrical Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering, or related field AND 3+ years technical engineering experience.
• 5+ years of hands-on experience in the field of package manufacturing, supplier management, quality/reliability management and supply chain technical/quality management
• 5+ years of experience in the Fabless semiconductor model with a broad knowledge of package technology, substrate manufacturing and advanced packaging (2D, 2.5D, 3D) and manufacturing

Preferred Qualifications

• MS degree with 10 years\xe2\x80\x99 experience in silicon packaging products development
• Foundation in advanced packaging technologies, manufacturing and supplier management
• Experience with OSAT, Supplier, Foundry technologies.
• Experience in physical failure analysis, subcontract supplier management.
• Record of success in cross-functional team environment
• Experience with 8D problem solving techniques
• Experience with statistical control and data analysis tools
• Experience with using AI/ML to analyze assembly data is a plus

Other Requirements:Ability to meet Microsoft, customer and/or government security screening requirements are required for this role.These requirements include, but are not limited to the following specialized security screenings:Microsoft Cloud Background Check:This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form.

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