Job Description

Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we\'ve been doing just that. Our technology helped people put a man on the moon.We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world\'s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.Binge-watch any shows, use social media or shop online lately? You\'ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That\'s us, too.We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital\xc2\xae, G-Technology\xe2\x84\xa2, SanDisk\xc2\xae and WD\xc2\xae brands.Today\'s exceptional challenges require your unique skills. It\'s You & Western Digital. Together, we\'re the next BIG thing in data.

• Key Technical Integration role to drive and enable product, silicon, process and materials technology roadmap solutions for next generation memory storage packaging solutions.
• To lead the 2.5D/3D advanced packaging conceptual to productization activities with global cross-functional teams including silicon design, product design, fab back-end, process engineering and test engineering in delivering Best-In-Class and Industry leading products
• To establish innovation strategies to achieve breakthrough in product packaging design, performance, quality and cost
• To engage in collaboration with suppliers, service providers, academia, industry consortium in establishing new industry standards
• To drive in-depth fundamental engineering investigation culture and problem-solving methodology in delivering robust packaging technology
• To coordinate industry benchmarking, competitive analysis.

Qualifications

• Minimum 10 years of Semiconductor Packaging Process with in-depth exposure to wafer RDL process, wafer bumping process, and/or TSV wafer processing technology in wafer fab backend, or high-density 2.5D / 3D advanced packaging architecture will be desired.
• Strong experience in driving technology roadmap and technology innovation to achieve best-in-class advanced packaging technology solutions.
• Strong engagement in Fab Backend or Packaging technology development experience and well-versed with R&D methodology.
• Proven experience with in-depth engagement in silicon design rule, materials and process technology fundamentals.
• Ability to lead complex technical investigation and analysis with global cross-functional teams. Ability to drive external CM / OSATs / suppliers on process qualification and co-development. Proven capabilities to navigate through highly dynamic and fast-paced project requirements and interdependencies.
• Experience in application of AI / ML-augmented engineering development and innovation and analytics.
• Strong degree in Mechanical / Materials Engineering (Bachelor/ Masters Degree). PhD research experience will be an added advantage.

Additional InformationWestern Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.NOTICE TO CANDIDATES: Western Digital has received reports of scams where a payment is requested on Western Digital\'s behalf as a condition for receiving an offer of employment. Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to .

Western Digital