Senior Soc Physical Design Engineer

Bayan Lepas, M07, MY, Malaysia

Job Description

Responsibilities include (but are not limited to):



You will be participating in the leading-edge System-On-a-Chip (SoC) design projects using cutting-edge process technology nodes for various client applications. Ideate, develop, and execute physical design solutions: floorplan, placement, routing, cell sizing, buffering, logic restructuring to improve timing and power. Participate in design/architecture reviews to track design milestones. Evaluate and deploy the evolving physical design methodologies to handle increasingly complex SoC/IP designs within aggressive, market-driven schedules. Active participation in benchmarking of library, technology parameters, and implementation strategy to enable design requirements of die size, power & speed. Actively work as part of a team both locally and with remote or multi-site teams. Actively assists full chip timing constraints development, full chip Static Timing Analysis, and timing signoff for a complex, multi-clock, multi-voltage SoC. Analyze and incorporate advance timing signoff flows (SSTA, LOCV Based STA, IR Drop aware STA) into SoC timing signoff flow. Active participation to enhance the flow from the front end (pre-layout) to the back end (post-layout) at both chip level and block level.

Key Requirements:



Minimum of a Bachelor's Degree in Electrical and/or Electronics Engineering, Computer Engineering, or any related discipline. Good understanding of Digital Logic, VHDL/RTL representation, Verilog Good scripting skills in Perl, Tcl, Python to handle and optimize CAD automation flow Experience with Synopsys EDA tools: Fusion Compiler, Primetime, IC Validator, VC Low-Power Experience with Cadence EDA tools: Innovus, Tempus, Virtuoso, Conformal Low-Power

Additional Skills:



Experience in advance FinFET process nodes and below (16nm, 12nm, 7nm, 5nm, 3nm), including low-power methodology Expertise in analyzing and converging crosstalk delay, noise glitch, and electrical/manufacturing rules in deep-sub-micron processes. Hands-on experience in full-chip or sub-chip Static Timing Analysis, timing constraints management, and timing closure. Signoff: Coformal, LEC, StarRC, PT, CLP, Calibre Quality, Redhawk Timing ECO, Functional ECO & Power ECO
Job Type: Full-time

Pay: RM4,329.29 - RM16,444.57 per month

Language:

Mandarin (Required)
Work Location: In person

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Job Detail

  • Job Id
    JD1286175
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Bayan Lepas, M07, MY, Malaysia
  • Education
    Not mentioned