Job Description

Location: Kulim
Job ID: 341151

Job description
In your new role you will:

• Perform root cause analysis for ICO/FAR related defects, evaluate defect prevention methodologies in relevant unit processes.
• Benchmark and perform interconnect-related process analysis for existing and new technologies to achieve maximum process capability against benchmark and work with UPS and BE engineering to eliminate defects and drive continuous improvement.
• Integration technical support in new technology transfer projects.
• Development of innovative processes and process characterization methodologies for existing and new interconnect technologies.
• Design & execute experiments and perform technical analysis &documentation on the results.
• Assessment of process changes and process change management
• Interface between business units, process engineering, frontend and backend sites, reliability engineering and production Interact and communicate effectively in cross functional teams e.g. in 8D teams and taskforces.

Your profile
You are best equipped for this task if you have:

• PhD/Master/ Degree in Physics/Chemistry/Material Science/Mechanical Engineering/Electronics Engineering or equivalent.
• At least 3-5 years of in-depth knowledge of characterization methodology on packaging assembly materials and processes.
• Good knowledge in material science, metallurgy, polymer science, advanced failure analysis (fractures, intermetallic & microstructure, interfacial adhesion, surface & chemical analysis, outgassing, stress).
• Good technical knowledge in chip-to-package interactions with regards to interconnect reliability, materials and processes (wafer saw, die attach, wire bonding, flip chip bonding, molding. All-round expertise in FOL processes preferred).
• Good experience in problem solving methodologies and design of experiment.
• Good interpersonal skills, analytical and leadership skills & a good team player.
• Must be a self-starter who can work both independently and in groups across different site functional teams.

Part of your life. Part of tomorrow.

We make life easier, safer and greener - with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world - we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources.

Does this sound like just the right challenge for you? If so, we look forward to getting to know you!

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Infineon