Responsible for package design tasks in OSAT segment which specialsingin Power Module construction and design of SiC and IGBT products for Automotive.
Give technical guidance within OSAT in development and pre-development of new package technologies, processes and materials.
Drive problem solving, hypothesis prioritization, using clear systematic approach to draw conclusions out of analysis and derives lesson learned.
Drive subcon partners to ensure projects are managed within time, budget and scope of project.
Be the main contact person within OSAT Development focusing in package development, technology integration and delivering solutions in highly complex FE/BE technology interactions.
Your profile You are best equipped for this task if you have:
Bachelor\'s/Master\'s Degree in Engineering or Physics.
Excellent technical knowledge of BE processes and materials in Power Module packages and interaction to the different functions (interaction of BOM, package construction, design rules and process).
Good understanding of Automotive quality requirements and standards.
Strong analytical skills, ability to deal with conflict and ambiguity.
Strong communication and stakeholder management skills across all levels.
Good knowledge of technical topics and strong in people interpersonal skills and experience in Subcon management.
Driving decarbonization and digitalization. Together.
Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.
Does this sound like just the right challenge for you? If so, we look forward to getting to know you!