Job Description

In your new role you will: * Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc) activities for package projects with major changes/new package, risks and impact. * In your new role you will: Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc) activities for package projects with major changes/new package, risks and impact. Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed. Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements, Coordinate the package Cost Estimation (A1-A3) and Cost Indication(A3). Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how. Support pre development & project definition stage and continue to be package design expert throughout project phase. Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons. Consolidate the inputs for ADR and ensure the contents are updated (A project). Main contact person and technical consultant/coach for all questions and discussion regarding packaging, package design and Package. Your ProfileYou are best equipped for this task if you have: Bachelor\'s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, Physics), At least 7 years of relevant working experience in IC/semiconductor environment, Semiconductor Packaging, Assembly and Test, Process and Equipment Engineering knowledge, Failure Analysis and Reliability Engineering, Analytical and problem solving Skills. Experienced inAutoCAD and 3Ddrafting preferred. Benefits What we offer you in Melaka Melaka is our biggest production site wordwide with more than 7000 employees.

Monster