Drive Technology Integration activities to ensure the package fulfill all requirements in the aspect of Process Interaction. Key working partner for FE colleagues for new FE technology.
Be the driver of Package Technology DFMEA
Be the owner of Risk Interaction assessment and mitigation work packages
Integration of unit processes (BOM and Process) in package platform - Risk assessment, study interaction with other processes, process flow
Support Pre development for new Chip technology.
Be the driver/team member for 8D/problem solving for interaction issues
Your profile You are best equipped for this task if you have:
At least 5 years of working experience in IC/semiconductor environment.
Semiconductor Packaging, Assembly and Test knowledge.
Good aptitude for communication, collaboration, negotiation and solution finding
Experience in 8D & T6s methodology.
Part of your life. Part of tomorrow.
Infineon is a world leader in semiconductor solutions that make life easier, safer, and greener. Our solutions for efficient energy management, smart mobility, and secure, seamless communications link the real and the digital world.
Infineon Technologies (Malaysia) Sdn Bhd, with its 8.000 employees, is the largest manufacturing site of Infineon. The company has established itself as a leading manufacturing site for Power Semiconductors, Logic Semiconductors, Discrete and Sensor Products. We are committed to increasing productivity, on-time delivery and providing customized solutions while maintaining the highest level of product quality. The success of Infineon Melaka is evidenced by eleven National Awards received from the Prime Minister\'s Office as well as 15 corporate awards.
Does this sound like just the right challenge for you? If so, we look forward to getting to know you!