Job Description

:WHAT YOU DO AT AMD CHANGES EVERYTHINGWe care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the worlds most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.AMD together we advance_THE ROLE:The positions primary task will be lead the design for validation platform in thermal mechanical engineering for Server CPU. Design Lead need to lead the team for thermal mechanical design, platform and component verification/validation testing to corelated the simulation results. The lead need to ensure the platform design is ready and validated to ship on time to customer.THE PERSON:We are looking for a strong thermal mechanical fundamentals and leadership skills in driving the team. A successful candidate will possess strong technical knowledge on methodologies and experimentations.KEY RESPONSIBILITIES:

• Manage overall design schedule planning, execution, and monitoring tracking.
• Lead the team for Thermal and mechanical design modeling, simulation and testing of components
• Part and assembly design, from concept to detail design to manufacturing introduction
• Validation of components in bench and system configuration
• Produce and maintain detailed technical documentation for customer consumption
• Create, manage, release, and maintain BOM's and assembly instructions
• Provide comprehensive customer support
• Coordinate with platform engineers and engineers from other internal teams to ensure that all design requirements are satisfied
• Work with EEs and PCB engineers to develop and fine tune PCBA board layouts and outlines
• Oversee product shipping packaging testing and provide guidance for packaging design
• Demonstrated successful experience in mechanical engineering within a product design and manufacturing environment

PREFERRED EXPERIENCE:

• Strong analytical skills, including structural (FEA, Ansys preferred) and thermal modelling (FloTherm, Icepak, preferred)
• Proficiency in CAD modeling (SolidWorks preferred)
• Detail oriented personality with solid documentation and reporting skills
• Excellent communication and interpersonal skills
• Proficient with the Microsoft Office Suite
• Understand of standard manufacturing processes and GD&T principles is a plus
• Experience using and automating tests using lab equipment is a plus (Instron, LabView)

ACADEMIC CREDENTIALS:

• Engineering degree (Mechanical / Mechatronics)

LOCATION:Penang, Malaysia#LI-SONG#LI-HybridBenefits offered are described: .AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants needs under the respective laws throughout all stages of the recruitment and selection process.

Advanced Micro Devices