Job Description

Key Responsibilities and Duties:

1. Strategic & Technical Leadership

Define the software and control technology roadmap supporting advanced packaging processes such as underfill jetting, TIM dispensing, flip-chip, chiplet-to-interposer bonding, and wafer-to-wafer hybrid integration. Lead multi-disciplinary teams in software architecture, motion control, computer vision, and data analytics for high-precision automation platforms. Align software development priorities with corporate R&D goals in sub-10-micron EHD jetting and multi-nozzle MEMS printhead systems. Mentor and grow a high-performing team of software engineers capable of supporting complex mechatronic and process-driven systems.

2. Software Architecture & System Integration

Architect modular, scalable, and reusable software frameworks that unify motion, vision, jetting, and AI feedback across NSW product lines. Ensure deterministic real-time control for multi-axis motion, synchronized jetting, and droplet metrology with sub?micron accuracy. Lead integration of process modules such as flux cleaning, plasma, curing, and inspection into unified automation platforms. Oversee communication layer design using EtherCAT, OPC-UA, Modbus, and proprietary protocols to ensure interoperability across machine subsystems.

3. Product Development & Execution

Translate semiconductor and packaging process requirements into executable software deliverables. Oversee the development of intuitive HMIs, data logging, recipe management, and closed-loop control systems. Manage concurrent software projects supporting new product introductions and customer-specific customizations. Collaborate with process, mechanical, and electrical engineering teams to ensure cohesive system performance and manufacturability. Drive joint-development projects with OEMs, controller vendors, and automation partners to accelerate system integration and feature enhancement.

4. Advanced Packaging Process Enablement

Work closely with process and customer to implement AI/ML algorithms for related process control. Lead software development for inline inspection and metrology systems (vision-based droplet detection, alignment correction, defect mapping). Support new applications in fan-out wafer-level packaging (FOWLP), chiplet integration, and advanced underfill through software-driven process control. Guide the digital transformation of equipment integrating MES/SECS-GEM, traceability, and predictive maintenance capabilities.

5. Innovation, Quality & Compliance

Drive continuous improvement in software lifecycle, validation, and risk control and SEMI standards. Establish robust testing frameworks, regression validation, and field-upgrade systems to ensure uptime and process reliability. Promote a culture of innovation and intellectual property generation through advanced algorithms, control logic, and UI/UX innovations.

Job Requirement

Bachelor's or Master's degree in Software Engineering, Mechatronics, Electrical Engineering, or Computer Science. 10-15 years of software engineering experience in semiconductor equipment, advanced packaging, or high-precision automation. Proven track record in real-time control, motion systems, or precision robotics for wafer-level or die-level processes. At least 5 years in a managerial or senior leadership role, leading cross-disciplinary software teams. Hands-on experience integrating motion controllers, vision systems and dispensing/jetting subsystems. Familiarity with semiconductor manufacturing standards (SEMI E30 GEM, SECS/GEM, E142 substrate mapping) and data protocols. Strong expertise in C#, C++, .NET/WPF, and Python.
Job Type: Full-time

Pay: RM8,000.00 - RM12,000.00 per month

Benefits:

Dental insurance Free parking Health insurance Opportunities for promotion Vision insurance
Application Question(s):

How long is your notice period?
Education:

Bachelor's (Required)
Language:

Mandarin? (Required)
Work Location: In person